Plating Process - メーカー・企業と製品の一覧

Plating Processの製品一覧

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Electroless Ni-P replacement Au plating process with excellent solder wettability.

Electroless Ni-P replacement Au plating process with excellent solder wettability.

For printed circuit boards. An alternative to the electroless Ni-P/replacement Au plating process is possible.

The 'Electroless Ni-P/Replacement Au plating process with excellent solder wettability' is an alternative plating process that uses 4Ag, which has similar characteristics to Au, allowing it to be a substitute for the electroless Ni-P/replacement Au plating process. The solder wettability is better immediately after plating than that of the electroless Ni-P/replacement Au plating. For more details, please contact us or download the catalog.

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Electroless Ni-P/Replacement Au plating process with excellent corrosion resistance as an alternative plating process.

Electroless Ni-P/Replacement Au plating process with excellent corrosion resistance as an alternative plating process.

For printed circuit boards. An alternative plating process with excellent corrosion resistance using electroless Ni-P/replaceable Au plating.

The electroless Ni-P/replacement Au plating alternative plating process forms a dense and corrosion-resistant Pd coating between the electroless Ni-P plating and the replacement Au plating, resulting in excellent corrosion resistance. Although a Pd coating is formed as an intermediate layer, the solder wettability immediately after plating is almost equivalent to that of electroless Ni-P/replacement Au plating. For more details, please download the catalog or contact us.

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Electrolytic Ni/Electrolytic Au plating with excellent corrosion resistance alternative plating process

Electrolytic Ni/Electrolytic Au plating with excellent corrosion resistance alternative plating process

On printed circuit boards. A Pd coating with excellent corrosion resistance is formed, providing outstanding corrosion resistance.

The 'Electrolytic Ni/Electrolytic Au Plating Alternative Plating Process' forms a dense and corrosion-resistant Pd coating between the electrolytic Ni plating and electrolytic Au plating, resulting in excellent corrosion resistance. The solder wettability immediately after plating is almost equivalent to that of electrolytic Ni/electrolytic Au plating. For more details, please contact us or download the catalog.

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ブックマークに追加いたしました

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ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

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